Considerations and Countermeasures for Reliability Design of BGA Solder Joints

Hisao Nishimori･Jun Muto･Yasufumi Shibata (Toyota Motor)

As electronic components become more advanced, designs increasingly place many BGAs—whose solder joints cannot be inspected visually—on the same board. This makes it essential to develop product designs and manufacturing processes that build in quality based on an understanding of failure modes. By characterizing BGA solder-joint conditions through both non-destructive and destructive analyses, this presentation introduces approaches to achieving robust designs that include manufacturing quality, drawing on international standards as part of the evaluation.

Manufacturing management approach with AI and statistical methods for improvement of Printed Circuit Boards manufacturing quality

Shunsuke Narita･Tai Horikawa･Tomoyuki Ueno (Nissan Motor)

High manufacturing quality is necessary for the realization of further advancement of printed circuit boards by the advancement of electronics in automobiles. We investigated a method to reconcile quality and efficiency by shifting manufacturing management from threshold-based management to distribution-based management. In this research, we propose the process of early generation of estimated distribution and outlier detection through the application of Bayesian Estimation from AI and ML processing capabilities.

Proposal for the Mechanism of Whisker Formation and Countermeasures from Sn Plating in High-Speed Communication Connectors: Part II

Jun Muto･Hisao Nishimori･Hitoshi Yakuden･Miiyu Orinaka･Yasufumi Shibata･Takashi Yamada (Toyota Motor)

In recent years, the shift to higher-speed communication has led to the adoption of connectors with various shield housings in automotive electronic components. Tin plating on zinc die-cast shield housings is known to produce whiskers driven by thermal stress. In this report, we present experimental results and, based on those findings, propose plating specifications predicted to suppress whisker formation.

Development of a simple evaluation method for abnormal heat generation phenomena in automotive ECUs under high-temperature environments

Koki Mori･Tai Horikawa･Fumito Kishi (Nissan Motor)

Electronic components can suffer random failures, and if current continues to flow after such a failure, abnormal heating can occur. Because automotive ECUs are used under more severe high-temperature conditions than ECUs for other applications, it is necessary to investigate the causes of such abnormal heating and to verify the effectiveness of countermeasure designs. This study proposes a method for constructing a simple high-temperature evaluation setup that does not require the use of costly temperature-controlled chambers.