Circuit Analysis Method using Coupled Electrical and Mechanical 1D Models in Collaboration with Tier 1 and Tier 2 Suppliers

Masashi Inaba (DENSO)･Hiroki Nakamizo･Wataru Hijikata (Tokyo Institute of Technology)･Takao Egami (Toshiba Electronic Devices & Storage)･Daisaku Mukaiyama (Rubycon)･Yoshinori Aruga (KOA)･Hiroki Takahara･Hideaki Fujita (Tokyo Institute of Technology)･Takuya Shinoda･Keita Omi (DENSO)

In recent years, the market's changing requirements for electrification have accelerated the need to shorten the ECU development period. As a solution, collaboration between Tier 1 and Tier 2 suppliers using MBD based on an Electrical and mechanical coupled 1D model has been attracting attention. In this experiment, we analyzed the operation of actuator drive circuits and calculated ECU heat generation using a model shared among suppliers.

Effects of the Actuator Behavior due to the Low-Temperature Characteristics of the Aluminum Electrolytic Capacitors

Daisaku Mukaiyama (Rubycon/Nagoya University)･Masanari Ueda (Siemens EDA Japan)･Yoshinori Aruga (KOA)･Masashi Inaba･Kazunari Hashimoto (DENSO)･Haruki Takei (Siemens)･Takao Egami (AC Technologies)･Hideki Jonokuchi (Nagoya Institute of Technology)･Takuya Shinoda (DENSO)

The aluminum electrolytic capacitor impedance is increased exponentially in a low-temperature range. Thus, we guess that the lower temperature limit should exist for applications that use aluminum electrolytic capacitors. In this study, we researched the lower temperature limit of the Actuator (Model) with the capacitor model which contains the temperature characteristics.

Analysis of Actuator Drive Circuits and Passive Component Operation through Tier 1 and Tier 2 Collaboration using MBD

Yoshinori Aruga (KOA)･Masashi Inaba (DENSO)･Masanari Ueda (Siemens)･Daisaku Mukaiyama (Rubycon)･Hiroki Nakamizo (Tokyo Institute of Technology)･Naoto Taoka (IDAJ)･Haruki Takei (Siemens)･Takao Egami (Toshiba Electronic Devices & Storage)･Hideki Jounokuchi (Nagoya Institute of Technology)･Takuya Shinoda (DENSO)

In the thermal design of in-vehicle electrical equipment that is becoming smaller and more sophisticated, it is important to consider not only semiconductors but also the small components (resistors, capacitors, etc.) in their peripheral circuits. This report describes a case study of a multi-domain analysis of a specific actuator (circuit/mechanical) and drive circuit (circuit/thermal). In addition, the report analyzes the operating waveform and temperature rise of the small components (resistors) for certain operating conditions.

Examining the Operation of Actuator Drive Circuits that Improve the Accuracy of Semiconductor Models in MBD

Takao Egami (AC Technologies)･Yoshiko Ikeda (Toshiba Electoronic Devices & Storage)･Masashi Inaba･Kazunari Hashimoto (DENSO)･Daisaku Mukaiyama (Rubycon)･Yoshinori Aruga (KOA)･Masanari Ueda (SIEMENS)･Takuya Shinoda (DENSO)

MBD also requires consideration of operating limits equivalent to those of actual semiconductor devices (ICs, MOSFETs). The actuator model was driven by a circuit constructed from a highly accurate semiconductor model that takes into account detailed electrical characteristics, and the operating waveform and self-heating were analyzed.

Switching Loss Issues in High Power Inverters and a Model that Takes IGBT Structure into Account and Supports Self-Heating

Noboru Takizawa

Due to the electrification of vehicles, the increase in drive power and the miniaturization of power devices have created a need to consider heat generation at the peak value of switching loss. This peak loss and conventional loss are shown here.　 Furthermore, we will present a concept for a self-heating compatible model using VHDL-AMS that takes into consideration the IGBT element structure required to improve the accuracy of switching loss.

Robust Design for Location of Thermal Interfacial Material by using MBD

Kazunari Hashimoto (DENSO)･Ryuta Yasui (Tokyo Institute of Technology)･Masashi Inaba (DENSO)･Takao Egami (AC Technologies)･Yoshinori Aruga (KOA)･Daisaku Mukaiyama (Rubycon)･Haruki Takei (Siemens)･Kazuyoshi Fushinobu (Tokyo Institute of Technology)･Takuya Shinoda･Keita Omi (DENSO)

The amount of heat generation in the electronic circuit can be calculated accurately by MBD due to putting into circulation of 1D model.
The balance of heat generation in the each electronic component will be changed from operating condition of ECU.
So far we took the logical sum from each worst condition.
We'll explain robust design for location of thermal interfacial material under some operating conditions.