Verification on the effectiveness of Electro-mechanical coupled 1D models for vehicle system analysis and ECU circuit analysis

Keita Inoue (DENSO)

To meet the increasing demand for shorter Automotive-ECU development cycles in recent years, the realization of MBD (Model-Based Development) requires a variety of analyses, including system-level, circuit-level, and thermal analyses. While the effectiveness of an electro-mechanical coupled 1D model of an in-vehicle electromagnetic actuator, which is sharing among industry partners (OEM, Tier 1, and Tier 2), has already been validated in circuit analysis, this study verifies its effectiveness in vehicle system-level analysis linked with ECU circuit analysis.

Conduction Noise Analysis of High-Precision IC and MOSFET Models Using Electro-Mechanical Coupled Simulation

Yoshiko Ikeda (Toshiba Electronic Devices & Storage)･Takao Egami (AC Technologies Co., LTD.)･Takashi Nakanishi (Toshiba Electronic Devices & Storage)･Masashi Inaba･Keita Inoue･Kazunari Hahimoto (DENSO)･Masanari Ueda (Siemens Electronic Design Automation Japan K.K.)･Daisaku Mukaiyama (Rubycon Corporation)･Yoshinori Aruga (Koa)･Takuya Shinoda (DENSO)

With the increasing functionality of automotive systems, the higher density, faster operation, and greater power of electronic control units have intensified challenges related to EMI (Electromagnetic Interference) and EMS (Electromagnetic Susceptibility). In this study, high-precision IC and MOSFET models developed last year were utilized to verify transient electrical and thermal responses on actuator boards within a collaborative research project. This year, we focus on applying these models to conduction noise analysis, aiming to establish an analytical approach that contributes to improving the reliability of automotive electronic systems.

A Modeling Study of Aluminum Electrolytic Capacitors Considering Lifetime Degradation

Daisaku Mukaiyama (Rubycon)･Masashi Inaba (DENSO)･Masanari Ueda (Siemens)･Yoshinori Aruga (KOA)･Yoshiko Ikeda (Toshiba Device and Storage)･Takao Egami (AC Technologies)･Kazunari Hashimoto (DENSO)･Hideki Jounokuchi (Nagoya Institute of Technology)･Masayoshi Yamamoto (Nagoya University)･Takuya Shinoda (DENSO)

We have been studying a multi-domain electrical and thermal model for aluminum electrolytic capacitors. Using a boost chopper as an example, we have evaluated the validity of the electrical characteristics model at low temperatures through simulations and actual measurements, achieving a certain level of results. In this work, we further examined the impact of lifetime degradation of aluminum electrolytic capacitors on impedance, and we report on these findings.

Effect of a Simulation Model Considering Dynamic Characteristics of Power Inductors on DC-DC Converter Performance

Kazuhiro Ito･Kota Saito･Kazuhisa Kitamura･Tomoya Morinaga (Murata Manufacturing Co., Ltd.)

This study evaluates the impact of condition settings on DC-DC converter characteristics using a simulation model that incorporates temperature, AC amplitude, and DC bias dependencies of power inductors, and demonstrates its effectiveness in improving simulation accuracy.

Resistor and PCB Modeling and Validation for Tier 1 and Tier 2 Collaboration Using MBD

Yoshinori Aruga (Koa)･Masashi Inaba (DENSO)･Masanari Ueda (Siemens Electronic Design Automation Japan K.K.)･Daisaku Mukaiyama (RUBYCON CORPORATION)･Hiroki Nakamizo (Institute of Science Tokyo)･Haruki Takei (Siemens)･Takao Egami (AC Technologies Co., LTD.)･Yoshiko Ikeda (Toshiba Electronic Devices & Storage)･Hideki Jounokuchi (Nagoya Institute of Technology)･Takuya Shinoda (DENSO)

In the thermal design of in-vehicle electrical equipment that is becoming smaller and more sophisticated, it is important to consider not only semiconductors but also the small components (R, C, etc.) in their peripheral circuits. In this report, a 1D model (coupled mechanical, electrical circuit, and thermal model) of an actuator drive circuit shared by WG members consisting of Tier1 and Tier2 is discussed. Furthermore, we discuss the modeling of resistors and substrates, along with their validation experiments.